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The official archive of ASE company news, technology announcements, awards, partnerships, and global manufacturing updates.

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Press Room

ASE Launches Automated 310mm Panel-Level Packaging to Accelerate AI Innovation

This milestone expands economies of scale by enabling a seamless transition from wafer level packaging to panel level packaging while preserving design rule consistency across…

2026.05.26

The ASE Group office tower in Kaohsiung seen from below, framed by trees

News

ASE and WUS Announce Strategic Collaboration to Build Advanced AI Packaging Hub in Kaohsiung

2026.05.08

AI vision overlays tracking operators and automated equipment inside an ASE cleanroom

News

ASE Breaks Ground on New Renwu Plant to Build Hi-tech Testing Cluster

2026.04.10

Architectural rendering of two new ASE manufacturing buildings beside a waterway

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ASE Breaks Ground on New High-Tech Facility in Kaohsiung, Investing NT$ 17.8 Billion to Meet AI Chip Demand

2026.03.11

Diagram of the ASE IDE 2.0 AI-enhanced platform linking package design, an AI optimization engine, and the e-Simulator big data engine

News

ASE Unveils IDE 2.0 – AI-Enhanced Platform Accelerates Package Design Accuracy and Innovation

2025.11.04

ASE staff in hard hats inspecting a planted green roof above a Kaohsiung facility

News

ASE K18B Groundbreaking Ceremony: Strengthening Our Competitiveness in Advanced Packaging

2025.10.03

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ASE Announces FOCoS-Bridge with TSV; Latest Package Technology Reduces Power Loss by 3x for Next-Generation AI and HPC Applications

2025.05.28

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ASE Demonstrates CPO that Improves Energy Efficiency for AI applications

2025.04.01

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ASE Drives AI and Green Transformation for a Sustainable Future in Kaohsiung

2025.03.20

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Ainos and ASE Partner to Power AI Scent Digitization in Semiconductor Manufacturing

2025.03.12

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ASE Expands its Chip Packaging and Testing Facility to Enable Next-Gen Applications

2025.02.18

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ASE Partners with Environmental Technology Research to Drive Net-Zero Transformation and Expand Green Energy Initiatives

2024.11.07