Smart watch and wristband
Processors, wireless connectivity, memory, health and motion sensors, power management and charging.
- WLCSP
- FOPoP
- SiP
- BGA
- QFN
- LGA
Applications
Smart Wearables
ASE heterogeneous-integration expertise places high-performance chips and sensors into small, power-efficient packages for products worn throughout the day.
More capability in a smaller form factor
Fitness trackers, watches, hearables and immersive headsets are changing how people communicate, monitor activity and share information.
As functions multiply, designers must integrate power management, connectivity, memory, sensors and processors within a very limited volume. ASE packaging helps make those products slimmer and more capable.
Product platforms
Packaging matched to wearable architectures
Smart hearables
Audio processing, BLE, memory, microphones, motion and proximity sensing in ear-scale systems.
- SiP
- WLCSP
- QFN
- BGA
- LGA
Smart glasses and VR/AR headsets
Application processors, wireless connectivity, memory, inertial sensors and power management.
- Flip Chip BGA
- WLCSP
- SiP
- QFN
- LGA
Heterogeneous integration for the wearable edge
A single wearable can require logic, radio, memory, MEMS, sensing and power devices manufactured in different processes. ASE integrates these functions while balancing performance, battery life, reliability and product dimensions.
