
Applications
High Performance Computing (HPC)
ASE supports complex HPC devices with heterogeneous-integration technologies spanning HFCBGA, 2.5D and 3D IC, FOCoS and silicon photonics packaging.
Compute at scale
More data demands more efficient integration
The growth of connected devices, streaming media and data-intensive services is increasing demand for networking infrastructure. Artificial intelligence and analytics place especially heavy requirements on high-performance systems.
Heterogeneous integration combines memory, optics and power technologies to increase bandwidth and packaging efficiency while reducing energy consumption.




Compute
Packaging solutions for processors and accelerators
| Device | Packaging solutions |
|---|---|
| CPU | HFCBGA |
| Accelerator | HFCBGA, 2.5D, FOCoS-CL, FOCoS-B |


Networking
Packaging solutions for data movement
| Device | Packaging solutions |
|---|---|
| Network switch / router | HFCBGA, 2.5D, FOCoS-CL |
| Optical transceiver | Silicon photonics packaging |

