High Performance Computing (HPC)
To support complex chip designs for HPC, ASE offers a comprehensive packaging portfolio that enables heterogeneous integration through technologies for High Performance FCBGA(HFCBGA), 2.5D/3D IC, FOCoS-CL, FOCoS-B and Si photonics packaging.
The exponential increase in the volume of data driven by the expansive growth in the Internet of Things (IoT), smart phones, video streaming and connected technologies, is accelerating the demand for networking infrastructure. AI and data analytics require insatiable computing power from HPC systems.
To meet the ever-increasing demands for higher performance and better energy efficiency, heterogeneous integration optimizes solutions for packaging efficiency. Memory integration, optics integration and power integration are widely adopted to achieve higher bandwidth, better energy efficiency and lower power consumption.
