Remote Web Terminal Design parameters key-in
Solutions
Package Design
Overview
ASE provides technical analysis and consulting to improve the IC-packaging development process and give circuit designers maximum flexibility.
Characterization labs
ASE's laboratory services deliver technical analysis and consulting built on decades of experience developing and manufacturing semiconductor packaging.
e-Service Tools
Real-time, web-based packaging services, running since 1999, that speed IC-package development.
e-Service
Since 1999. Through interactive windows, users assign simulation models for optimal electrical and thermal results, generate bonding diagrams from a specific lead-frame or substrate, and issue cases to ASE's characterization labs (via OLES). It is also the system to request simulation and measurement services.
w-Service Server Thermal / Stress / Electrical simulation using ANSYS based on finite element method
ASE e-Mail System Automatically sending results from e-Services server to customer
e-Thermal Simulator
Since 1999. Enter design parameters and get a package's thermal resistance within 3 hours, using finite-element methods (FEM) on ANSYS. Models available for QFP (PQFP, LQFP, TQFP) and BGA (PBGA, HSBGA).
e-Stress Simulator
Since 2008. Enter design parameters to get the stress and warpage distribution of a BGA package, using FEM numerical analysis on ANSYS; reports are emailed back.
e-Electrical Simulator
ASE's Electrical Lab compiled simulation and design cases into a cloud database (e-Service), so customers can look up estimated package electrical data anytime. For an accurate model, request a 3D electromagnetic-solver simulation through e-Service.
