e-Thermal Simulator
A finite-element ANSYS workflow estimates package thermal resistance from customer dimensions and operating conditions, with models for QFP and BGA families.
Other Services
Package Design
ASE combines package architecture, characterization laboratories, online engineering services, and electrical, thermal, and stress simulation to improve package development and give IC designers greater design flexibility.
Design backed by characterization
ASE provides technical analysis and consulting informed by decades of semiconductor packaging development and manufacturing. Laboratory specialists help teams evaluate material, electrical, thermal, mechanical, optical, and reliability tradeoffs early in the design process.
The design organization works across package selection, layout, modeling, verification, and manufacturability to improve performance while containing cost and development time.
ASE e-Service
ASE began developing real-time web-based packaging services in 1999. The platform allows customers to assign package models, compare electrical and thermal performance, generate bonding diagrams for selected leadframes or substrates, and request simulation and measurement support from the characterization labs.
A shared case-and-experience database also gives customers a direct path to estimated package electrical data and more detailed 3D electromagnetic modeling when required.
Remote package simulators
e-Stress Simulator
Remote finite-element analysis predicts stress and warpage distributions for BGA package designs.
e-Electrical Simulator
A cloud database provides estimated electrical data and a request channel for accurate 3D electromagnetic and package-modeling services.
