KAOHSIUNG, Taiwan, March 11, 2026 – Advanced Semiconductor Engineering, Inc. (ASE, a member of ASE Technology Holdings Inc, NYSE: ASX, TWSE: 3711) officially broke ground today to mark the construction of two new buildings at the Nanzih Technology Industrial Park III. With a total investment of NT$17.8 billion, construction is set to begin in 2026 and expected to be completed by the second quarter of 2028.
Upon completion, the new facility will create approximately 1,470 jobs and deliver an estimated annual output value of NT$4.63 billion per hectare.
As AI, high-performance computing, and high-speed communication applications continue to expand, the semiconductor industry is seeing growing demand for advanced packaging and testing services. The new facility integrates logistics, manufacturing, and testing capabilities to enhance supply-chain efficiency and capacity.
The architectural design is guided by ecology, energy efficiency, health, and waste reduction, aiming to minimize construction waste while creating a modern smart factory that is environmentally friendly and highly efficient.
One building will serve as a Smart Logistics Center, featuring a highly efficient automated warehouse that integrates material receiving and dispatch, inventory management, and delivery. Smart logistics equipment and a digital management platform will provide real-time tracking of material flow, inventory status, and dispatch points.
The second building is dedicated to high-end packaging and testing for AI and HPC. It will house an integrated testing and system validation platform offering one-stop services to accelerate product introduction and improve quality-control efficiency.
The facility will accommodate lead-frame and BGA products and system testing for high-frequency and power-management modules. Testing capabilities will evolve toward high frequency, high power, and high parallelism to support increasingly complex advanced packaging and module products.
Beyond capacity expansion, the facility represents a strategic investment for the AI era. Sustainable building practices and waste reduction reinforce ASE’s ESG commitments while creating an advanced base that harmonizes industrial growth with environmental responsibility.
About ASE, Inc.
Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative VIPack™, advanced packaging, and system-in-package solutions to meet growth momentum across a broad range of end markets, including AI, automotive, 5G, high-performance computing, and more.
To learn about our advances in SiP, fanout, MEMS and sensor, flip chip, and 2.5D, 3D and TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit the ASE Website, or follow us on LinkedIn and X: @aseglobal.
