Integrated Design Ecosystem™
Integrated Design Ecosystem
IDE 2.0 is ASE's AI-enhanced co-design environment for advanced packages, accelerating design iteration, improving chip-package interaction analysis, and shortening time to market for complex AI and HPC applications.
Introducing IDE 2.0
A major step forward in package co-design
Building on the foundation of the Integrated Design Ecosystem™ (IDE), IDE 2.0 represents a major upgrade and transformative progress in advanced package co-design. The enhanced platform integrates artificial intelligence (AI) to enable faster design iterations, optimize chip-package interaction (CPI) analysis, and accelerate time-to-market for complex AI and high-performance computing (HPC) applications.
The IDE 2.0 Workflow
The ASE IDE 2.0 workflow can dramatically reduce overall design-analysis cycle time from weeks to hours. Key performance highlights include:
- Simulation acceleration: Reduces design iteration time by more than 90%, cutting a 14-day process to just 30 minutes within defined design parameters.
- Integrated multiphysics simulations: Enhances accuracy across electrical, thermal, warpage/stress, and reliability domains.
- AI-based risk prediction: Generates predictive assessments within 60 seconds, enabling real-time design optimization.
Integrating AI into the IDE 2.0 Workflow
Through its new cloud-based e-Simulator, ASE's IDE 2.0 leverages AI engines to perform CPI predictive risk assessments and optimize design, analysis, and manufacturing data. As advanced packaging continues to play a pivotal role in semiconductor innovation, IDE 2.0 delivers a step-change in efficiency – reducing design cycles and enabling unprecedented precision, performance, and streamlined workflows for ASE's customers.
IDE 2.0 introduces an AI-driven feedback framework that continuously connects design and analysis in real time. This intelligent loop enables design teams to innovate faster while managing increasing architectural complexity across multi-die, chiplet, and heterogeneous integration technologies. By combining multiphysics-based simulation, real-world data, and AI insights, IDE 2.0 dramatically improves speed, precision, and reliability in semiconductor package development—empowering customers to make smarter, data-driven design decisions.
ASE IDE 1.0 Workflow
- 50% design cycle time reduction
- Efficiency due to EDA tools integration
- RDL/Si interposer auto routing
- Package analyses to validate design
ASE IDE 2.0 Workflow
- >90% design cycle time reduction
- 11 AI engines for evaluating electrical, thermal, stress and reliability risks
- <60s design optimization
- Adaptive correlation based on real-time manufacturing data
