Solutions

Integrated Design Ecosystem™

Overview

An AI-driven co-design platform that cuts advanced-package design cycles from weeks to hours.

Building on the original Integrated Design Ecosystem™, IDE 2.0 is a major upgrade in advanced-package co-design. It brings artificial intelligence into the flow to speed up design iterations, sharpen chip-package interaction (CPI) analysis, and get complex AI and HPC products to market faster.

Press Release

The IDE 2.0 workflow

The IDE 2.0 workflow can cut overall design-and-analysis cycle time from weeks to hours. Three highlights stand out:

Simulation acceleration

Cuts design-iteration time by more than 90%, taking a 14-day process down to about 30 minutes, within defined design parameters.

Integrated multiphysics

Improves accuracy across electrical, thermal, warpage/stress and reliability domains at once.

AI risk prediction

Generates predictive risk assessments in about 60 seconds, enabling real-time design optimization.

IDE 1.0

	Request	Simulation	Reporting	Review
Electrical	0.5 days	1–2 days	5 mins	5 mins
Thermal	1–3 days	2–7 days	1–2 days	1–2 days
Stress	1–3 days	2–7 days	1–2 days	1–2 days

Cycle time14 days

Accuracy>90%

IDE 2.0

	Request	Simulation	Reporting	Review
Electrical	<1 min	15 mins	5 mins	5 mins
Thermal	10 mins	1–20 mins	1 min	N/A
Stress	10 mins	20 mins	1 min	N/A

Cycle time30 mins

Accuracy>90%

How AI fits in

Through a new cloud-based e-Simulator, IDE 2.0 uses AI engines to run CPI predictive risk assessments and to optimize design, analysis and manufacturing data.

It adds an AI-driven feedback loop that continuously connects design and analysis in real time, so teams can innovate faster while managing growing complexity across multi-die, chiplet and heterogeneous-integration designs. Combining multiphysics simulation, real-world data and AI insight improves speed, precision and reliability, helping customers make smarter, data-driven design decisions.