HFCBGA
High-performance flip-chip BGA for large, complex processors.
Applications
Artificial Intelligence (AI)
Advanced semiconductor packaging is essential to the performance, energy efficiency and reliability demanded by modern artificial-intelligence systems.
Compute architecture for emerging AI
Artificial intelligence is reshaping natural-language processing, recognition, autonomous systems and industrial automation. Like HPC, it depends on high compute and storage capacity connected by very wide interconnects.
Purpose-built accelerators such as GPUs, ASICs and FPGAs can deliver faster, more energy-efficient processing than general-purpose software running only on CPUs.
Heterogeneous integration
Packaging platforms for powerful, efficient ICs
ASE combines advanced substrates, high-density interconnects, memory integration and optical capabilities to support the processors at the center of AI infrastructure.
2.5D / 3D IC
Dense die-to-die integration for logic and high-bandwidth memory.
FOCoS-CL and FOCoS-B
Fan-out chip-on-substrate options for advanced heterogeneous systems.
Silicon photonics
Optical integration that supports high-bandwidth, energy-efficient data movement.
AI inside smart manufacturing
ASE also applies predictive analytics to its own smart factories, using production data to improve equipment performance, quality, reliability and cost efficiency.