FCBGA-based AiP
An RF chip mounts beneath a multilayer organic substrate with the antenna array built above it.
System-in-Package
Antenna in Package
ASE integrates mmWave antennas, RF transceivers, front-end devices, and power management into compact packages and modules, backed by system design, simulation, assembly, and precise over-the-air measurement capability.
What is Antenna in Package?
AiP implements one or more antennas in an IC package carrying a bare RF transceiver. SiP processes can add power amplifiers, low-noise amplifiers, switches, filters, and power-management ICs to create a complete antenna module.
At mmWave frequencies, integrating the transceiver close to the antenna reduces interconnect loss and improves signal integrity while keeping the module small.
ASE mmWave AiP offerings
AiP modules
Smartphone modules combine a multilayer antenna board, RF silicon, and a flexible interconnect to the main board.
Hybrid-substrate AiP
A BT substrate and low-loss antenna FPC combine compact RF assembly with efficient high-frequency transmission.
Applications and measurement
AiP supports 60GHz radios and gesture radar, 77GHz automotive radar, 94GHz phased arrays, 122GHz imaging, 300GHz wireless links, and 5G mmWave bands.
ASE and Keysight developed a measurement system for beamforming and antenna-array validation. Compact-range and spherical probing support wafer and panel configurations as well as S-parameter measurement from 10MHz through 115GHz.
- Shorter RF path
- Smaller package footprint
- Lower system-design complexity
- Repeatable over-the-air characterization
