Plastic BGA substrate
Multilayer glass-fiber laminate substrates for high-speed, high-power, automotive, communications, graphics, and medical packages.
Other Services
Packaging Substrate
ASE designs and manufactures advanced packaging substrates that connect semiconductor dies to the package and system board, integrating substrate and assembly expertise for reliable quality, fast cycle time, and high-volume ramp.
A value-critical part of the package
As package dimensions shrink and performance rises, substrates carry more complex signal, power, and ground structures while accounting for a larger share of package value and performance.
ASE integrates assembly and substrate technologies to deliver a broad range of wire-bond BGA and flip-chip products. Stub-less etch-back, advanced selected-gold, and double-pattern-sputter options support high-frequency and high-performance designs.
ASE Packaging Substrate offerings
Flip-chip CSP substrate
Coreless and embedded-layer structures with fine-line capability for application processors, modems, connectivity, Bluetooth, and networking.
BOC and LPDDR
Short-wire, cost-effective memory substrates for high-frequency and low-power DRAM products.
Module substrate
Coreless multilayer substrates that integrate active and passive devices for wireless, wearable, fingerprint, GPS, RF, TWS, and IoT modules.
a-S³ single-sided substrate
A single-sided build-up flow targeting lower profile and lower cost for application processors, networking, and connectivity.
Integrated design and manufacturing
In-house design, stable high-volume capacity, and close integration with packaging operations allow ASE to shorten cycle time, support customer ramps, and align substrate rules with the electrical, thermal, reliability, and cost goals of the final package.
- Thin-core and coreless options
- High-density interconnect
- Automotive-grade quality
- Advanced surface finishes
- Flexible multilayer signal, power, and ground design
