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Packaging Substrate

Overview

As semiconductor back-end services increasingly outsource, the substrate business is a necessary complement to IC assembly.

ASE focuses its R&D on low-cost, high-performance, thin, miniature, reliable and environmentally compatible substrates for next-generation IC packages.

Substrates are a growing, value-added part of packaging, and their share of total package cost keeps rising, especially for advanced packages like flip-chip BGA. By integrating assembly and substrate technologies, ASE delivers reliable quality, cost-effectiveness and fast cycle time, with stable high-volume manufacturing for quick ramp-up.

ASE's substrate capability supports a wide range of wire-bond BGA and flip-chip products, and offers stub-less solutions, etch-back, a-SG (advanced selected gold) and DPS (double pattern sputter), for high-frequency, high-performance packages.

Package offerings

Packaging substrate offerings

Plastic BGA substrate

Plastic BGA (PBGA)

Wire-bonded die on a glass-fiber / resin copper-clad laminate, encapsulated in epoxy molding compound; suited to high-power, high-speed packages needing better thermal and electrical performance.

Applications

Microprocessors/controllers, Gate arrays, Automotive, ASIC, PLDs/DSPs, Digital TV, Graphics & PC chipsets, Communications & networking, Medical.

Features
  • Low assembly cost; thinner via thin core
  • High reliability/quality for automotive
  • High interconnect density
  • Stub-less (etch-back, a-SG, DPS)
  • Sizes 15×15 mm to 45×45 mm; multi-layer options
fcCSP substrate

fcCSP Substrate

Solder bumps on the die mount onto a flip-chip substrate; chip-side embedded structure.

Applications

Application processor, Bluetooth, Networking, Modem, Connectivity.

Features
  • Coreless, thinner structure
  • Cost-effective
  • Fine-line capability in the embedded layer
  • Higher interconnect density (Embedded Trace Substrate, ETS)
BOC DDR substrate

BOC (DDR substrate)

A cost-effective CSP for high-frequency memory; shortest wire length and strong electrical performance for central-pad layouts using wire-bond + BGA.

Applications

SDRAM, SGRAM, DDR SDRAM, RAMBUS DRAM and next generation.

Features
  • Cost-competitive for high-performance DRAM
  • Rigid 2-layer substrate
  • JEDEC-standard 60 balls
  • Customer substrate design available
  • 1.2 mm max thickness
Low Power DDR substrate

Low Power (LP) DDR substrate

A reliable memory substrate for low-power packages with efficient, high-speed data transmission.

Applications

Cell phones, Smartphones, Mobile computers, Notebooks, Various LPDDR package series.

Features
  • Thin overall thickness
  • Coreless process
Module substrate

Module substrate

Interconnects multiple active and passive devices in one package.

Applications

Wireless modules, Fingerprint reader (Touch ID), Wearables, RF modules, BLE modules (TWS, IoT), GPS/navigation.

Features
  • Compact, light, multiple devices in one
  • Various surface finishes; cost-effective
  • Shorter electrical paths for better connectivity
  • Thin, coreless, multi-layer options
a-S³ single-sided substrate

a-S³ (single-sided substrate)

Built with a single-side build-up flow.

Applications

Application processor, Networking, Connectivity.

Features
  • Cost reduction
  • Low profile
  • Cost-effective solution

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