KAOHSIUNG, Taiwan, May 8, 2026. Advanced Semiconductor Engineering, Inc. (ASE) and WUS Printed Circuit Co., Ltd. (WUS) announced today a strategic collaboration for the construction of a state-of-the-art manufacturing facility in the Nanzih Technology Industrial Park, Kaohsiung. The two companies plan to jointly deploy resources to expand advanced manufacturing capacity that will reinforce Taiwan’s critical position in the global semiconductor value chain.
Announcement Highlights
- Generating over 2,000 employment opportunities.
- Scheduled for completion by September 2029.
- Featuring a modern factory building with a total floor area of over 113,000 square meters.
Driving the AI and HPC Revolution
Artificial Intelligence is accelerating the growth of high-performance computing, cloud services, and data centers and driving increasing demands for memory and logic chips and advanced packaging technologies in chip stacking, chiplet integration, CoWoS, and FOCoS. These developments from chip design to fabs, packaging and test, and board and system manufacturing have resulted in greater synergy across the ecosystem.
The new facility will focus on advanced packaging processes, including FOCoS and FC BGA technologies, to serve emerging AI, cloud computing, and autonomous-driving applications. It will integrate automation and smart manufacturing to maximize productivity and efficiency. A 161kV substation will be built within the park to support continuous and stable power supply.
“This landmark agreement is a strategic collaboration between ASE and WUS to improve land use efficiency and allow ASE to expand our manufacturing capacities to meet market demands,” said Mike Hung, Executive Vice President of ASE. “We are also excited to establish a new benchmark for future collaborative industrial development.”
Commitment to Sustainability
The proposed facility will be designed according to EEWH green building gold standards, integrating energy-saving, carbon-reduction, and environmentally friendly practices. Both ASE and WUS are strongly committed to sustainability and net zero.
About ASE, Inc.
Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative VIPack™, advanced packaging, and system-in-package solutions to meet growth momentum across a broad range of end markets, including AI, automotive, 5G, high-performance computing, and more.
To learn about our advances in SiP, fanout, MEMS and sensor, flip chip, and 2.5D, 3D and TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit the ASE Website, or follow us on LinkedIn and X: @aseglobal.
