
Heterogeneous Integration (HI)
Integrates separately made components into a higher-level assembly (SiP) for more function, higher bandwidth and lower power.

ASE is a leading provider of independent semiconductor packaging and test services. Our technology goes into electronics people use every day.

ASE packages and tests semiconductors for the world's electronics makers, and runs the smart factories that produce them at scale.

Integrates separately made components into a higher-level assembly (SiP) for more function, higher bandwidth and lower power.

The assembly that packs more capability into a smaller, connected package.

ASE runs its factories on AI, big data and automation, working toward smart factories that need little human intervention. This lifts productivity and quality while making the supply chain more responsive to customer demand. ASE built the first OSAT 5G mmWave smart factory and keeps expanding its smart-factory footprint across sites.
Industry 4.05G mmWave Smart FactoryASE covers far more of the chip journey than packaging alone. The work spans front-end engineering test, wafer probing, package and substrate design, assembly and final test, through to module and board assembly with sister company USI. Handling these stages together gives customers one accountable partner from bare silicon to finished module.
Semiconductor Supply Chain

Sustainability is built into how ASE operates. We invest in cleaner manufacturing, water recycling, and greener buildings, and that work consistently ranks among the best in the industry.
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