
Electrical Lab
Package design, modeling, SI/PI analysis, high-frequency measurement, electrical failure analysis, and mmWave antenna characterization.

Other Services
Since 1995, ASE's characterization laboratories have used advanced instruments and packaging expertise to evaluate electrical, material, mechanical, thermal, acoustic, chemical, environmental, failure-analysis, and optical challenges.
ASE's labs support new-material evaluation, package and system co-design, process optimization, reliability verification, and failure investigation. The teams connect numerical simulation with physical measurement so engineering decisions can be checked against production-relevant evidence.
Services range from high-frequency electrical characterization and optical measurement through stress, warpage, thermal, acoustic, and chemical analysis.

Package design, modeling, SI/PI analysis, high-frequency measurement, electrical failure analysis, and mmWave antenna characterization.

Physical, chemical, surface, and mechanical characterization for material selection, process optimization, and failure-mechanism analysis.

Package and board stress, warpage, thermal performance, mold flow, reliability simulation, and physical measurement.

Chemical analysis and environmental evaluation supporting materials, processes, compliance, and sustainable manufacturing.

Cross-disciplinary analysis that locates defects and identifies electrical, material, structural, and process-related failure mechanisms.

Optical simulation, measurement, image analysis, and package characterization for emitters, receivers, sensors, and photonic systems.

Acoustic imaging and measurement for package integrity, interfaces, voids, delamination, and sound-related devices.
Laboratory teams work with ASE's package, substrate, assembly, and test organizations so a simulation or measurement can feed directly into material selection, structure optimization, process correction, or reliability improvement.