3D System-in-Package (3D SiP)

Driven by IoT, edge computing, wearables and next-generation wireless, more electronic components are assembled into a single unit to provide the functions of a system or subsystem. Double side molding (DSM) first addressed this by assembling die on both sides of a substrate. To shrink the package further and add more function, ASE developed 3D System-in-Package, with a three- or four-side assembly structure.

3D SiP is a very-high-density assembly structure with three- or four-side assembly on top and bottom substrates, interconnected by signal-routing interposers in between to raise packaging density. Active components (fcCSP, WLCSP, silicon die, MEMS) and passive components (resistor, capacitor, inductor, crystal or oscillator) can mount on both sides of both substrates.

interposer assembly, top-board assembly, and bottom-board (module) assembly. Methods include SMT, molding, sawing and shielding.

3D SiP suits package sizes from 6×6 mm² to 30×30 mm², for wearables (watch, earphone), wireless chargers, RF front-end modules and sensor systems. Its main advantages, miniaturization and more function integration, make it a good platform for consolidating heterogeneous chips into a small form factor.