BGA packages that use plastic (epoxy molding compound) as the encapsulation. Per JEDEC, PBGA has an overall thickness of over 1.7 mm.
Applications
- Graphics, PC chipsets, microprocessors/controllers, PLDs
- Communications, networking, DSPs
- ASIC and gate arrays, memory packages
Features
- 15×15–45×45 mm; 119–1520 balls; JEDEC MS-034 outlines
- High interconnect density, low profile, self-alignment during reflow
- Easy thermal/electrical management and routing; low assembly cost; good power dissipation; lead-free available; full in-house design
