PBGA
Plastic BGA packages combine epoxy encapsulation with 119 to 1,520-ball options for graphics, chipsets, processors, communications, networking, memory, and ASIC products.
Other Packaging
Wire Bond BGA
ASE's wire-bond ball-grid-array packages use the full substrate area for interconnect routing, creating a high-density, self-aligning, and thermally adaptable platform for high-power and high-speed ICs.
High-density area-array interconnect
BGA packages place board connections in a solder-ball matrix on laminated BT or polyimide substrates. Short power and ground paths reduce inductance, while heat sinks, thermal balls, and other enhancements can lower thermal resistance.
- High interconnect density
- Self-alignment during reflow
- Low profile and straightforward routing
- Flexible thermal and electrical management
ASE Wire Bond BGA offerings
HSBGA
A copper heat slug within the molded body can reduce junction-to-ambient thermal resistance and support high-power graphics, networking, and communications ICs.
FBGA
Fine-pitch BGA shortens trace length and reduces package size for high-speed DRAM and dense memory modules.
Designed for scalable performance
ASE's portfolio spans compact fine-pitch memory packages through large, thermally enhanced BGAs. In-house design, lead-free process options, JEDEC outlines, and board-level reliability support make the platform adaptable to computing, communication, consumer, and specialized applications.
