Advanced RDL Packaging
Silicon Photonics
ASE's silicon photonics and co-packaged optics capabilities move high-volume data with light, helping AI and data-center infrastructure increase bandwidth while reducing latency and energy per bit.
Silicon photonics and its advantages
Silicon photonics integrates photonic functions with the CMOS manufacturing ecosystem. Dense photonic integrated circuits can filter, modulate, and route light in a compact and cost-effective chip.
Where conventional electrical links face growing signal-integrity and power challenges at high speed, optical transmission provides a path to higher bandwidth and stronger energy efficiency.
From pluggable optics to co-packaged optics
Commercial pluggable transceivers have reached 800Gbps. On-board optics places engines near the ASIC, while co-packaged optics and optical I/O shorten the remaining electrical path and improve both energy per bit and cost per gigabit.
Technical building blocks and applications
Optical performance requires package and assembly processes developed specifically for photonic products.
- Post-fab wafer bumping and silicon etch
- High-accuracy laser-die bonding
- 2.5D/3D, TSV, fan-out, and chip-on-wafer integration of electrical and photonic ICs
- Wafer-level optical probing for known-good photonic dies
- Pluggable, on-board, and co-packaged optics for hyperscale data centers, HPC, AI, and machine learning