Safety and ADAS
Airbag control, facial recognition, LiDAR, radar, stability control, ultrasonic sensing and driver assistance.
Applications
Smart Automotive
ASE packaging and test technologies power automotive systems that demand high reliability, integration efficiency, safety and long operating life.
Enabling safer, cleaner and more connected vehicles
Semiconductor packaging and test technologies support new generations of vehicles with improved safety, comfort and convenience while the market shifts toward energy-efficient electric platforms.
ASE works with automotive customers to integrate image and environmental sensors, controllers and communication devices that collect, analyze and act on information throughout the vehicle.
Smart Automotive
Systems across the vehicle
Body and chassis
Climate control, tire-pressure monitoring, steering, braking, suspension and environmental sensing.
Infotainment and instrumentation
Navigation, audio, head-up displays, driver monitoring, gesture control and entertainment.
EV / HEV and powertrain
Battery management, electric drive control, inverters, charging, engine and transmission control.
A broad automotive packaging portfolio
Applications draw on ASE leadframe, wire-bond, flip-chip, wafer-level, MEMS and sensor, module and advanced packaging technologies. The portfolio also supports inertial measurement units, power devices and optocouplers.
- Packages engineered for automotive quality and reliability
- Sensor and controller integration for compact intelligent systems
- Power packaging for electric mobility and charging infrastructure
