SiP platform
A base architecture for true-wireless and hearing-device products.
Smart Hearables
ASE system-in-package platforms help hearable designers combine audio, wireless, sensing and power functions in extremely compact, reliable products.
From audio accessory to intelligent interface
Earphones now connect with phones, computers, consoles, televisions and other smart devices. True wireless audio and biometric sensing have expanded them into always-available digital interfaces.
Their small enclosure creates difficult electrical, acoustic and mechanical trade-offs, including noise, crosstalk, radio performance and manufacturing cost.
SiP advantage
Miniaturization, optimization and simplification
ASE SiP solutions help customers improve manufacturing yield, functional reliability and time to market while increasing the capability packed into each device.
- Deliver clean sound quality
- Optimize RF performance for stable wireless connections
- Integrate more sensors and chip functions
- Support waterproofing and noise cancellation
- Reduce overall product size
A customizable open module platform
The platform combines a SiP reference design, development module and sensor-integration design. It supports multiple microphones and the heterogeneous integration of processors, memory, filters, MEMS, sensors, passives and preassembled subsystems.
Open source modules
Reference, development and sensor modules that shorten electrical design work.
Product application design
Support for earbuds, motion sensors, electronic stethoscopes and health-monitoring devices.
The ASE ATOM Earbud
ASE demonstrated the platform in a 3D-printed earbud that integrates electro-acoustic components, battery, PCB, microphones, antennas and inertial sensing. Its simplified layout shows how system-level packaging can speed assembly while preserving functionality.
