System-in-Package
powerSiP™
powerSiP™ is ASE's vertical power-delivery platform for AI, HPC, and data-center systems, designed to shorten current paths, lower routing loss, and raise power density in a footprint smaller than a side-by-side voltage-regulator layout.
Vertical power delivery
powerSiP™ integrates a multi-stage voltage-regulator module vertically, including an option to place regulation directly under the SoC and chiplets. A shorter supply path reduces impedance in the power-delivery network and supports large current delivery.
The platform's vertical layout occupies about 25% less area than a traditional side-by-side arrangement, creating more flexibility around high-power compute packages.
Power-efficiency gains
- Lower PDN impedance
- Higher system efficiency
- Improved functionality and power density
Built for AI and HPC roadmaps
ASE developed powerSiP™ around the performance and power requirements of AI accelerators, high-performance computing, and data centers. The platform is available now and is planned to evolve with system roadmaps and application requirements.