Based on a copper leadframe, QFN (microchip carrier) uses half-encapsulation to expose the rear of the die pad and the tiny fingers that connect the chip and bond wire to the PCB. Suitable for applications above 12 GHz, it provides both thermal and electrical enhancement and stays cost-effective thanks to economical materials and a simpler process.
Applications
- Telecommunication products — cellular phones, wireless LAN
- Portable products — PDAs, digital cameras
- Low-to-medium lead count — information appliances
Features
- Small footprint; low profile (< 0.9: 0.2 L/F + 0.65 mold); light weight
- Better electrical performance and power dissipation
- Cost-effective
