QFN and aQFN™
No-lead packages expose the rear die pad and compact fingers for cost-efficient thermal and electrical performance, including multi-row aQFN designs with I/O counts up to 400.
Other Packaging
Leadframe Packaging
ASE's mature leadframe portfolio provides robust, cost-effective packages for consumer, automotive, memory, analog, microcontroller, communications, and power products, with options tuned for electrical, thermal, and mechanical performance.
ASE leadframe package offerings
Leadframe technologies continue to evolve through finer pitch, lower profiles, exposed thermal pads, and higher I/O density.
QFP
Fine leadframes, short interconnects, and optional heat spreaders support processors, ASICs, DSPs, memory, and power-control products.
LQFP and TQFP
Low-profile and thin quad packages offer a broad range of lead counts and exposed-pad options for portable, RF, memory, DSP, and communications devices.
PLCC, SOJ, SOP, and PDIP
Established JEDEC-compliant forms provide socketable, surface-mount, and through-hole options for controllers, memory, consumer, automotive, and industrial products.
Performance advantages
- Cost-effective copper leadframes and established assembly flows
- Low-profile and small-footprint configurations
- Exposed-pad and heat-spreader options for better power dissipation
- Short interconnects for stronger high-frequency performance
- Lead-free processes and JEDEC-compliant outlines
Application breadth
ASE leadframe packages serve cellular and wireless products, portable electronics, information appliances, processors and controllers, automotive electronics, power and voltage regulators, aerospace devices, and a broad range of analog, logic, and memory ICs.
