System-in-Package
ASE embeds active semiconductor dies within organic laminate or leadframe structures, freeing surface area and shortening electrical and thermal paths for compact power, connectivity, sensor, optical, and automotive modules.
Instead of mounting every die on top of a substrate, the semiconductor is placed inside laminated PCB material or a leadframe as the substrate is formed. Copper-plated vias and traces then connect the embedded device to MEMS, passives, and other surface components.
ASE combines substrate design and manufacturing with packaging and test to provide a turnkey embedded-die service.
Advanced Embedded Active System Integration
A leadframe-based option for power electronics, with direct copper-via paths, strong heat dissipation, EMI benefits, and flexible BGA, LGA, or QFN footprints.
Semiconductor Embedded in Substrate
A thinned IC is embedded in a laminated substrate that can carry additional components, creating compact, multifunction modules for connectivity, power, sensor, memory, and ADAS products.
