Electrical verification
Confirm device operation against the intended specification range.
Other Services
Test Services
ASE provides front-end engineering, wafer probing, final test, module test, over-the-air mmWave validation, and system-level test across logic, mixed-signal, RF, MEMS, SiP, 2.5D/3D, automotive, AI, and HPC products.
A complete semiconductor test portfolio
ASE combines a broad installed base of test platforms with program development, program conversion, interface-board and mechanical-tool design, burn-in, dry-pack, and tape-and-reel services.
Multi-function expertise spans chipset, graphics, CPU, embedded memory, RF, analog, data converters, DSP, MCM, and SiP, supporting rapid ramps and cost-effective production.
- Front-end engineering test and wafer probing
- Final test for logic, mixed-signal, RF, and 2.5D/3D packages
- SiP, MEMS, discrete, and 5G mmWave module test
- System-level test and production value-added services
Customer-oriented engineering
ASE develops customized test solutions on advanced equipment and helps customers verify electrical specifications, assess long-term reliability, and investigate devices that do not meet performance requirements.
Reliability analysis
Assess long-term behavior and suitability for the target application.
Failure analysis
Identify mechanisms behind electrical or reliability-test failures.
Automated manufacturing and re-screen
Automated flows cover pre-test, production, equipment management, and delivery. ASE's Singulated Re-Screen Process can remove WLCSP dies from tape-and-reel, reconfigure them on film frame, probe with the production probe card, and return tested devices to tape-and-reel.
Test engineering also supports visual and electrical wafer inspection and final testing from low-pin-count devices through complex, high-frequency logic, memory, mixed-signal, and RF semiconductors.
