Electrical verification
Assesses whether a device complies with its various operating specifications.
Solutions
Test Services
Overview
ASE provides a complete range of semiconductor test, backed by leadership across many test platforms.
- Front-end engineering test
- Wafer probing
- Final test of high-performance logic, mixed-signal, RF and 2.5D/3D packages
- Module test of SiP / MEMS / discrete, and over-the-air (OTA) testing of 5G mmWave modules
- System-level test (SLT)
Plus a broad range of test-related services: electric interface board and mechanical test-tool design, program conversion, program-efficiency improvement, burn-in testing, dry-pack, and tape & reel.
Coverage
ASE tests across communications, automotive, home entertainment, IoT, PC, AI and HPC, plus consumer and application-specific ICs.
With deep expertise in test platforms, program conversion and test-program development, ASE covers SoC, MCM and SiP testing as more functions pack onto a single chip or package.
Capabilities
Deep test capabilities make ASE an effective solution provider with rapid time to market.
ChipsetGraphicsEmbedded DRAM / MCMCPURFAnalogADC / DACDSP
Engineering CommunicationTest HW/SW Designing & CodingTest HW/SW Correlation & ReleaseProduction Value Added
Support
ASE develops customized test solutions and verifies each device against its full set of requirements.
With deep expertise in test platforms, program conversion and test-program development, ASE covers SoC, MCM and SiP testing as more functions pack onto a single chip or package.
Reliability analysis
Assesses long-term reliability and suitability for the intended application.
Failure analysis
Investigates when a device doesn't meet specification during verification or reliability testing.
Automation
Production runs automatically, from pre-test through to product delivery and equipment management.
Singulated Re-Screen Process
A process to rework singulated die in tape-and-reel when customers need to re-probe. It reprocesses WLCSP die packed in tape & reel: de-tape, reconfigure singulated die in a film frame, probe the singulated die, then pick-and-place back to tape & reel. The probe card is the same as production, so no new probe card is needed.
Tape & ReelWLP ReconstructionFilm Frame WaferSingulation Die ProbingPick & PlaceTape & Reel
Capability
Customized test-solution development across wafer sort, final test and burn-in.
Wafer sort
Visual inspection and electrical test of processed wafers to customer spec. Pins from ten-thousands to multi-site hundreds; wafer size 6–12 inches; probe cards (micro-spring, vertical, cantilever, membrane); temperature −40 to 125°C; digital, analog, RF and automotive devices; WLP singulated re-screen.
Solution development
- Test-program coding
- Correlation & release
- Probe-card design & fabrication
- Debugging
Final test
Logic, mixed-signal and RF devices with leads from single digits to several hundreds and frequencies up to several GHz. ASE has the largest installed test-equipment base among independent providers. Also burn-in, system-level test, visual inspection, singulated top marking, dry pack, tape & reel.
Solution development
- Program development (digital, analog, RF, automotive)
- Load-board design & fabrication
- Handler change kit
- Socket design & fabrication
Burn-in
Burn-in stress for different power requirements (5–600 W) for product-lifecycle validation, especially automotive devices.
Solution development
- Software coding
- Test-hardware design & fabrication
