Solutions
Double Side Molding
Overview
Assembling components on both sides of the package for high integration in a smaller footprint, ideal for 5G RF front-end modules.
As consumer functionality grows, more active dies and passive components are integrated into one package or module. Mobile and IoT designs demand a small form factor, and conventional single-side packaging is no longer optimal because it makes the package larger. Double side molding (DSM) allows top- and bottom-side assembly with high integration, and is especially suited to RF front-end modules (FEM), where 5G keeps adding components.
Features
DSM packages
DSM packages use a two-side assembly structure, typically with a fine-pitch SMT process for a small form factor, plus a backside grinding step that reduces the height of the bottom molding compound, die and solder ball (or Cu pillar) for a thinner package. Compartment shielding (wire cage, wire fence or vertical wire) can be added to provide EMI shielding for sensitive components.
Capabilities
- I/O pitch: BGA ≥ 0.35 mm, LGA ≥ 0.28 mm
- Package-level reliability: pass
- Board-level reliability: pass
Package offerings
DSM LGA (ENIG Solution)
DSM LGA (Pre-solder Solution)
Advantages
Key advantages
- 20–40% smaller X-Y size than a single-side molding package
- Thinner than a single-side molding package
- Lower packaging cost from higher component-integration density within the mold tool
- More functionality through double-side integration
- Exposed die for better external thermal dissipation
Applications
High Function Integration
DSM suits any SiP that needs high function integration in a small footprint, including RF front-end modules (PAMiD, PAMiF, WiFi module, mmWave FEM) and wearable devices (watch, TWS earbuds).
