DSM BGA
A solder-ball interface for board assembly.
System-in-Package
Double Side Molding
Double Side Molding packages assemble and protect components on both sides of a substrate, increasing functional density and reducing footprint for RF front-end, mobile, IoT, wearable, and other highly integrated modules.
A two-sided structure for compact modules
DSM packages typically pair fine-pitch SMT with backside grinding to reduce the height of the lower mold compound, die, and solder-ball or copper-pillar structure.
Optional wire cages, wire fences, or vertical-wire compartment shielding protect sensitive devices from electromagnetic interference within the densely populated module.
- BGA I/O pitch from 0.35mm
- LGA I/O pitch from 0.28mm
- Package- and board-level reliability qualification
ASE DSM package offerings
DSM LGA with ENIG
An electroless nickel immersion gold land-grid interface.
DSM LGA with pre-solder
A pre-soldered land-grid option for specific assembly requirements.
Advantages and applications
DSM can reduce X-Y area by roughly 20–40% compared with a single-side molded package, while allowing exposed-die options for external heat dissipation.
The platform is suited to highly integrated RF front-end modules such as PAMiD, PAMiF, Wi-Fi and mmWave FEM, as well as watches and true-wireless stereo products.
- Smaller and thinner package
- More functions per mold area
- Lower packaging cost through integration density
- Improved thermal options
