KAOHSIUNG, Taiwan, Oct. 3, 2025 – Advanced Semiconductor Engineering, Inc. (ASE, a member of ASE Technology Holdings Inc, NYSE: ASX, TWSE: 3711) held a groundbreaking ceremony today for its K18B factory in Kaohsiung, Taiwan. The new facility is designed to support rapidly growing demand for AI, automotive electronics, and high-performance computing.
Scheduled for completion in the first quarter of 2028 with an investment of NT$17.6 billion, the factory will create nearly 20,000 new jobs focused on advanced packaging processes and system-in-package. This includes Copper Pillar Bumping, FOCoS, and FC BGA for CoWoS and chiplets.
The K18B factory features a VC-B grade anti-vibration design and an independent Central Utility Building for centralized management of electricity, cooling water, and compressed-air systems. It also incorporates intelligent fire evacuation guidance and AIoT fire-safety inspection systems.
In line with ASE’s commitment to sustainability, the factory will use low-carbon building materials, smart energy management, and recycled-water systems, aiming for EEWH Gold certification and a Fire Material Label.
“As advanced packaging becomes increasingly vital in the semiconductor value chain, ASE will continue to invest in cutting-edge technologies and equipment to meet the rising global demand for AI and HPC,” said Dr. Mike Hung, Senior Vice President of ASE Kaohsiung.
The investment marks a pivotal step in ASE’s pursuit of a dual transformation of advanced and sustainable operations, reinforcing its vision for a smarter, greener, and more resilient semiconductor ecosystem.
About ASE, Inc.
Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative VIPack™, advanced packaging, and system-in-package solutions to meet growth momentum across a broad range of end markets, including AI, automotive, 5G, high-performance computing, and more.
To learn about our advances in SiP, fanout, MEMS and sensor, flip chip, and 2.5D, 3D and TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit the ASE Website, or follow us on LinkedIn and X: @aseglobal.
