Optical compatibility
- Clear or selectively dyed encapsulation
- Filter coating
- Silicon, plastic, or microlens arrays
System-in-Package
MEMS and Sensor Packaging
ASE provides application-specific packaging for MEMS, optical, environmental, RF, biomedical, and inertial sensors, combining wafer-level and TSV processes with optical modeling, material characterization, stress simulation, and high-volume assembly.
Packaging is part of the sensor function
MEMS devices combine mechanical elements, sensing functions, and electronic circuits on silicon. Unlike a conventional package that primarily protects a chip, a sensor package must provide the acoustic, pressure, optical, chemical, or mechanical access the device needs to work.
ASE develops mold, open-cavity, air-cavity, leadframe, organic, ceramic, metal, plastic, and wafer-level options to balance device function, protection, reliability, and commercial requirements.
Application-specific materials and assembly
Sensor performance
- Optical simulation
- Hermetic and semi-hermetic sealing
- Dedicated assembly methods
Integration flexibility
- Modular IC and micromechanical integration
- Wafer-level and TSV options
- LiDAR receiver structures
ASE MEMS and sensor offerings
OCQFN and OQFNPressure, gas, light, and gesture sensing
Open-cavity and optical QFN platforms provide mature, cost-efficient structures with clear-mold and automotive-ready options.
- MEMS and MCU integration
- Transparent molding options
- Support for emitters and receivers
CoW and OLGATiming, proximity, imaging, and optical sensors
Chip-on-wafer and optical LGA processes support very small devices, proprietary panels, clear molding, custom lenses, and filter integration.
- MEMS oscillators
- Ambient-light, color, gesture, and ToF sensors
- Silicon photonics and image sensors
PMQFN and iLGARF, fingerprint, and LiDAR
Pre-mold QFN and image-LGA platforms combine controlled cavities, covers, collimators, encapsulation, and strip-level coatings for demanding sensor products.
- Automotive-grade reliability
- Wafer-level lens or collimator
- LiDAR and CMOS-image-sensor support
Growth markets
- Mobile, consumer, wearables, medical, biometrics, and AR/VR/MR
- Automotive, ADAS, autonomous systems, robotics, and Industry 4.0
- High-performance computing, communications, 5G, IoT, and environmental hubs
