Solutions

MEMS and Sensor Packaging

Overview

Packaging that is part of the device's function, letting sensors see, hear and feel the world.

MEMS (Micro-Electro-Mechanical Systems) and sensors let us experience and interact with our surroundings. A MEMS device combines mechanical elements, sensing features and electronic circuits on a silicon substrate, gathering information by measuring mechanical, thermal, biological, chemical, acoustic, optical and magnetic stimuli. Wafer-level packaging and TSV are key enabling technologies that optimize size, functionality and performance for cost-effective integration. ASE brings extensive modeling-lab capability, including optical simulation and measurement, material measurement and stress simulation.

The rise of robotics, autonomous vehicles, smart homes, IoT, AR/VR/MR and environmental hubs is accelerating MEMS and sensor development.

Different types of sensors

Inertial

Gyroscope
Accelerometer
Magnetometer/Hall-Effect Sensor
Combo & IMU

Light & Radiations

X-ray Sensor
Bolometer
IR Sensor
IR Thermopile
UV Sensor
PALS/ALS
LiDAR

RF

Oscillators
Switches
SAW Filters
FBAR/BAW Filters

Environmental

TPMS Module
Gas Sensor
Pressure Sensor
Temperature Sensor
Humidity Sensor
Si Microphone

Others

Optical/micromirror
LED
Ultrasonic Sensor
Medical Sensor

What is it

MEMS is a process technology for making tiny devices that combine mechanical and electrical components and can sense, control and actuate.

Unlike traditional packaging that only protects the chip, MEMS packaging is part of the device's function: microphones and pressure sensors need sound or pressure inlets; optical devices need materials that pass the right wavelengths. Package types include mold, air (with leadframe, organic or ceramic substrate), metal/plastic and wafer-level, matched to each application and its reliability requirements. Integrated sensor hubs and sensor fusion are increasingly important in phones and wearables.

Integrated sensor hub/sensor fusion* has become more and more important in the latest cellphones and wearable devices.

QFN metal oxide gas sensor

A cavity and functional opening allow environmental sensing.

LGA metal oxide gas sensor

An LGA format supports compact environmental sensor integration.

Advantages

MEMS and sensor packaging offer modularity, high flexibility and relatively low fabrication complexity, integrating the IC with micro-mechanical components.

Because they are more application-dependent than conventional packaging, they add specific benefits:

Optically compatible materials

Clear molding / encapsulation
Customized dyed encapsulant
Filter coating
Silicon or plastic lens and microlens array

Improved sensor function

Optical simulation
Hermetic sealing
Dedicated assembly methodology

Package offerings

ASE offers a variety of sensor packaging solutions that leverage upon an established database of material properties and assembly experience to address dedicated sensor requirements of different microelectronic, optoelectronic, RF, biomedical device, sensor, actuator and microsystem applications.

OCQFN

Pressure Sensor

OCQFN (Open Cavity Quad Flat No-lead)

Pkg~ 7x7
MEMS (accelerometer & pressure), MCU integration
Since 2014
Cost-efficient and mature packaging
Also suitable for gas sensor, emitter/receiver

OQFN

Ambient Light Sensor

OQFN (Optical Quad Flat No-lead)

Pkg~ 2x2
Support consumer, automotive application
Since 2016
Transparent molding compound is available
Also suitable for gesture sensor, emitter/receiver

CoW

Timing

CoW (Chip on Wafer)

Pkg~ 1.5x1
MEMS oscillator
Since 2017
WLCSP
Also suitable for silicon photonics, imaging sensor

OLGA

Proximity Sensor

OLGA (Optical Land Grid Array)

Pkg~ 2.5x1.5
ALS, color, gesture integration
Since 2015
Assembly of proprietary plastic panel
Clear molding
Customized molding lens
Also suitable for bio sensor, ToF sensor, imaging sensor

PMQFN

RFIC

PMQFN (Pre-mold Quad Flat No-lead)

Pkg~ 5x5
Molded fence with cover
Automotive grade reliability
Since 2015
Semi-hermetic
Also suitable for illuminator and LiDAR receiver/emitter

iLGA

Fingerprint Sensor

iLGA (image Land Grid Array)

Pkg~ 16x6
Collimator integration
Dispensed/Molded encapsulant
Since 2016
Wafer-level collimator/lens
Strip-level filter coating
Also suitable for LiDAR imaging and CMOS image sensors

LiDAR

LiDAR Receiver Packaging Offerings

ASE offers advanced sensor solutions for the automotive industry, especially LiDAR (light detection and ranging) for autonomous vehicles. LiDAR measures distance and scans the environment accurately: conventional LiDAR sends out infrared light and times how long it takes to bounce off an object and back, building a 3D map; advanced Frequency Modulated Continuous Wave (FMCW) LiDAR can also determine an object's reflectivity and speed (5D). These 3D or 5D maps let autonomous vehicles react promptly and take preventive action.