Single-sided molding
A traditional compact module architecture for integrated satellite radio components.
Applications
Satellite Communications
ASE combines satellite communications ICs in compact system-in-package modules designed for the next generation of global mobile connectivity.
A new mobile capability
Extending communication beyond terrestrial networks
Direct satellite connectivity is expanding smartphone coverage through low-, medium- and geostationary-orbit systems. Early two-way messaging services point toward broader real-time communication in areas terrestrial infrastructure cannot fully reach.
Advanced packaging is central to this evolution because it reduces the size and cost of the radio subsystems required inside mobile devices.
- Emergency and remote communication
- Global coverage and seamless switching
- Access to new markets and services
Satellite Communication SiP Module
ASE integrates the satellite transceiver front-end with Wi-Fi and Bluetooth front-end components in one module. The system can connect to multiple satellite and Wi-Fi/Bluetooth antennas, with additional antenna integration available where required.
Double-sided molding
Components are mounted and protected on both sides to increase functional density.
3D SiP integration
Vertical integration delivers the greatest space savings for highly constrained mobile designs.
A pathway to future non-terrestrial communications
ASE has supported successive generations of mobile communication from 2G through 5G. As 6G develops, satellite integration can extend reliable communication to remote regions and create significant new market opportunities.
The Satellite Communication SiP Module gives customers a cost- and space-efficient alternative for that transition.