Overall molding (FCCSP)
Protects the chip, replaces underfill for lower cost, and improves thermal performance and 2nd-level reliability.
Solutions
Flip Chip Packaging
Overview
Flip chip flips the die to connect via solder or gold bumps, spreading I/O pads across the whole chip surface.
That shrinks die size, optimizes the circuit path and cuts signal inductance. An essential step is wafer bumping; ASE can bump 6-, 8- and 12-inch wafers.
Benefits
One-pass bonding, denser I/O and shorter paths, with direct heat removal and a lower profile.
Shorter assembly cycle time (all bonding in one process)- Higher signal density and smaller die (area-array pad layout)
- Good electrical performance from the short die-to-substrate path
- Direct thermal path for an external heat sink
- Lower profile (no wire or molding)
Capabilities
ASE offers several BGA packages using flip chip technology.
| Package | I/O | Package size (mm) | Substrate | Ball pitch (mm) |
|---|---|---|---|---|
| CCSP | 16–200 | 4×4 – 14.0×22.0 | 2/4-layer laminate | 0.5–1.00 |
| Ceramic FCBGA / PGA | <1556 | 27×27 – 49.5×49.5 | Ceramic | 0.8–1.27 |
| FCBGA | 100–1521 | 27×27 – 40.0×40.0 | 2/4 laminate, 4–8-layer build-up | 1.0 / 1.27 |
| HFCBGA | 256–2401 | 12×12 – 52.5×52.5 | 4–8-layer build-up | 1.0 / 1.27 |
Heat spreader (FCBGA)
Adheres to the rear of the die for direct heat conduction; 6–8 W dissipation under natural convection.
Packaging offerings
ASE flip chip packaging offerings
Wafer Level CSP (aCSP / WLCSP)
A chip-scale package for around 200 I/O or fewer. FCCSP gives better chip protection and solder-joint reliability than direct chip attach (DCA) or chip on board (COB), and beats known-good die (KGD) for low-cost test and burn-in while performing comparably — in a thin, small, lightweight package.
Applications
- Consumer — camcorders, digital cameras, DVD
- Computer — voltage regulators, high-speed memory, cards, PC peripherals
- Telecommunication — pagers, cellular handsets, GPS
Features
- Wafer thinning down to 6–8 mils for packages under 1.0 mm
- 2-layer BT laminate substrate to reduce cost; thin core (100 µm) + via-on-pad for better electrical performance
- Over-molded process for throughput and reliability; NSMD with OSP C4 pad for low-cost interconnect
Flip Chip BGA (FCBGA)
Laminate and build-up organic substrates provide strong electrical performance for high-frequency computing, network and communications products.
High-Performance FCBGA (HFCBGA)
A heat spreader lowers junction-to-case resistance and improves external cooling for high-power devices.
