Solutions
A package or module that holds a whole electronic system or subsystem, miniaturized through IC-assembly technologies. ASE leads SiP from design to high-volume manufacturing.
Semiconductor miniaturization and integration are unleashing the potential of System-in-Package: a package or module that contains a functional electronic system or subsystem, integrated and miniaturized through IC-assembly technologies. It delivers higher performance, cost-effectiveness and shorter time to market across a huge range of electronics.
ASE is the leader in SiP, from design and assembly to high-volume manufacturing, serving a broad spectrum of applications and markets.
What is it
ASE defines SiP as a package or module that contains a functional electronic system or subsystem, integrated and miniaturized through IC-assembly technologies. Unlike generic IC packaging, SiP relies on heterogeneous integration of single or multiple chips (such as a specialized processor, DRAM or flash memory), SMD resistors/capacitors/inductors, filters, connectors, MEMS devices, sensors, other active and passive components, and pre-assembled packages or subsystems.
ASE's SiP draws on established IC-assembly capabilities: Copper wiring, flip-chip, wafer-level packaging, fan-out WLP, 2.5D/3D IC and embedded-chip packaging, serving mobile, IoT, HPC, automotive and AI.
Complete SiP manufacturing capability
ASE offers complete SiP manufacturing capability, including system design, software development, module testing and electrical heat-transfer simulation, to enable smaller, higher-performance, lower-power and more cost-effective products.
SiP-id
SiP-id is an enhanced reference flow that includes IC-packaging and verification tools from Cadence, plus a methodology that aggregates wafer-, package- and system-level design requirements into one unified, automated flow. It lets chip designers reduce design iterations and greatly improve throughput versus existing advanced-packaging EDA tools, sharply cutting the time to design and verify ultra-complex SiP packages.
The design tools are available to eligible customers immediately, though some proprietary libraries and design rules are subject to an agreement with ASE. It is an ongoing effort covering fan-out (such as FOCoS), panel fan-out, embedded substrates and 2.5D, as well as making the tools more user-friendly and efficient.
A DRC deck is required for fan-out design, and a 3D DRC deck for SiP design. Customers can engage ASE's in-house engineering to begin.
Customer
ASE TeamSiP is widely adopted for wireless communication, computer storage, power and sensor applications.
SiP is widely adopted for wireless communication, computer storage, power and sensor applications, and it enables smart living, smart bike, smart city, smart automotive and smart hearables. ASE develops advanced SMT, encapsulation, shielding and interconnection technologies for 5G communication, AR/VR sensing and healthcare.
