Shielding
Conformal, compartment, selective, and magnetic shielding manage electromagnetic interference.
System-in-Package
System-in-Package
ASE develops System-in-Package solutions from design through assembly and high-volume manufacturing, integrating active and passive components into compact functional systems with higher performance, lower power, and shorter time to market.
What is System-in-Package?
A SiP is a package or module containing a functional electronic system or subsystem that has been integrated and miniaturized through IC assembly technologies.
Unlike a conventional single-chip package, SiP development may combine processors, DRAM, flash, passives, filters, connectors, MEMS, sensors, other active devices, and pre-assembled subsystems in one product.
Enabling technologies
ASE combines established assembly platforms with specialized processes for compact mobile, IoT, HPC, automotive, and AI systems.
Interconnection
Wire bond, flip chip, cap wire bond, and high-density SMT connect dies and passives.
Stacking
Die thinning, package-on-package, 2.5D, and double-sided assembly increase functional density.
Antenna integration
Antenna-on-package and antenna-in-package reduce RF path length and module size.
Turnkey manufacturing and intelligent design
ASE supports SiP system design, software development, electrical and thermal simulation, package configuration, reliability verification, module testing, and final-test solution development.
SiP-id unifies wafer-, package-, and system-level requirements in an automated Cadence-based design and verification flow. The methodology reduces repeated iterations when teams explore complex fan-out, embedded, 2.5D, and system-level architectures.
Applications
- Wireless communication and RF modules
- Computing and storage systems
- Power, sensor, and optical modules
- Smart living, smart city, automotive, and hearable products
- 5G, AR/VR sensing, health, and IoT devices
