Technology conferences
Explore ASE advances in heterogeneous integration, panel-level packaging, chiplets, silicon photonics, and high-performance test.
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Events
Meet ASE at the conferences, technology forums, and industry gatherings shaping the future of semiconductor packaging and test.
Connect with ASE
ASE participates in leading semiconductor events worldwide to exchange ideas, present technical advances, and meet customers and ecosystem partners.
ASE’s official event endpoint currently exposes a client-rendered listing rather than indexed event-detail URLs. This rebuilt page preserves the complete public event route and directs visitors to the latest verified conference activity and contact path.
Industry collaboration
Join conversations with foundries, designers, material suppliers, equipment makers, and research partners across the semiconductor ecosystem.
Customer engagement
Contact the ASE team to arrange a discussion during an upcoming conference or regional industry event.
2026 conference focus
ASE is participating in the 76th IEEE Electronic Components and Technology Conference in Orlando, Florida, from May 26 to May 29, 2026, alongside continuing industry engagement around AI and next-generation advanced packaging.