Input formats
- GDS II
- Office-format netlists
- Pad coordinates
- Ball-out data
Other Services
Substrate Design
ASE's substrate and leadframe design teams develop high-performance, reliable, and cost-effective interconnect solutions that align package construction with product performance and time-to-market goals.
Turnkey substrate and leadframe design
The substrate is both a major cost element and a primary influence on package electrical, optical, thermal, and mechanical behavior. ASE's experienced design teams optimize layouts and structures for small, thin, high-performance products without separating design decisions from manufacturing capability.
Function and service coverage
- Optical transmittance, reflectivity, illuminance, and wavelength analysis
- Color temperature, chromaticity, color rendering, and luminous-flux evaluation
- Optical-structure and view-angle optimization
- Module signal and crosstalk analysis
- Dimensional measurement and drawing support
Design tools and deliverables
Design platforms
- Cadence
- Xynetix
- AutoCAD
Output drawings
- Gerber RS-274X layout
- PDF layout drawing
- AutoCAD and PDF bonding diagrams