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Advanced Semiconductor Engineering — semiconductor packaging and test

Rooted in ExperiencePerfected in Execution

Smart Manufacturing by ASE

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Silicon Photonics

Join us in exploring the possibilities of silicon photonics and stay ahead in this rapidly evolving field!

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Robotic Sensing

Step into the Future: Discover the Evolution of Robotic Sensing!

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Technology leadership

Our technology solutions have enabled our customers to create cutting edge products that deliver superior performance, power, speed, and connectivity.

System-in-Package

MEMS and Sensor

VI Pack

Silicon Photonics

FOCoS

2.5D and 3D IC Packaging

FOCoS-Bridge

Heterogeneous Integration

FOPoP

FOSiP

3D SiP

Double Side Molding

Antenna in Package

Test Services

Lab Services

As a primary architect of Heterogeneous Integration, ASE is redefining what's possible in semiconductor packaging — integrating chiplets, memory, and advanced technologies into a single, high-performance assembly.

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Markets enabled by ASE and semiconductors

Our technology solutions have enabled our customers to create cutting edge products that deliver superior performance, power, speed, and connectivity.

Applications Overview

Sustainability Drives the Future

Who we are and what we do

All around us, digital transformation is changing the way PEOPLE live, work, play and communicate. As a leading provider of semiconductor packaging and test services, ASE is playing a significant role in the development of the world’s most innovative electronics. Our technologies have also enabled our customers to create cutting edge products that deliver superior performance, power, speed and connectivity.

About ASE

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