System-in-Package
Fan-Out SiP
Fan-Out SiP replaces conventional laminated-substrate constraints with fine redistribution layers, giving compact multi-function systems a flexible, high-performance, and cost-effective integration platform.
Features of Fan-Out System-in-Package
Chip-last RDL manufacturing provides finer lines than mainstream substrates, while a carrier system makes thin-wafer handling practical. Wafer-level assembly adds high-speed SMT and molded underfill, and optional shielding sputtering supports demanding RF products.
Together, these process blocks form a complete toolbox for integrating active chips and passive components into a compact system or subsystem.
Benefits of Fan-Out SiP
- Flexible RDL routing to tune system performance
- Roughly 5× finer line-and-space capability than wire-bonding approaches
- Approximately three fewer substrate layers
- Cost-effective wafer-level processing and high-speed SMT
- Optional five-side shielding for broader RF use
Applications
Fan-Out SiP addresses smartphones, tablets, RF infrastructure, edge computing, and IoT. The platform is designed for products that must combine higher operating frequency, better performance, smaller dimensions, and consumer-scale economics.