Ideas & Insights

Technology Papers

Explore ASE Technology Papers perspectives, technical papers, field notes, and semiconductor industry insights.

30 articles

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Advanced Packaging from FOWLP to FOPLP Development of FanOut Chip Last in 300 mm Panel

We demonstrate a successful implementation of Fan-Out Chip Last technology in a 300 mm panel platform, achieving higher density, larger module size, and improved reliability.…

2025.06.26

Technology Papers

Technology Enhancements on FOCoS-Bridge for Emerging Trends in HPC and AI

2025.06.26

Technology Papers

Compact Dual Band 1×4 Antenna Array With Frequency Selective Surface-Base (Fss) for 5G AiP Applications

2025.06.26

Technology Papers

Fine-Line RDL Structure Analysis of Fan-Out Chip-on-Substrate Platform

2025.03.11

Technology Papers

Signal Integrity Analysis of UCIe Channel in FOCoS Advanced Package

2025.01.02

Technology Papers

High Accuracy Selective Patterning for EMI Shielding of 5G AiP

2024.06.26

Technology Papers

Reliability Prediction and Improvement of Board-Level Thermal Cycling Test for Molded Flip-Chip Ball-Grid-Array Package

2024.03.18

Technology Papers

A Precision Enhancement Deep Learning Framework for Package Substrate Defect Detection

2023.12.22

Technology Papers

Design and Optimization of Test Socket for Millimeter-Wave Steerable Beam Measurement Technology

2023.12.11

Technology Papers

Antenna in Package with Double-Layer Parasitic Elements for 28/39 GHz Applications

2023.09.07

Technology Papers

Butt-Coupling Optical Probe Card for Wafer-Scale Photonic-Integrated-Circuits Test with Polarization Control

2023.09.04

ASE slide showing in-vitro diagnostic bio-chip modules built with system-in-package integration

Technology Papers

Patch-type Flex SiP Platform for Heathcare Application

2023.08.03