Technology Papers
Advanced Packaging from FOWLP to FOPLP Development of FanOut Chip Last in 300 mm Panel
We demonstrate a successful implementation of Fan-Out Chip Last technology in a 300 mm panel platform, achieving higher density, larger module size, and improved reliability. These advancements make 300 mm panel-level fan-out an attractive solution to meet the evolving demands of nextgeneration HPC and AI applications.
