Technology Papers
Ideas & Insights
Technology Papers
Explore ASE Technology Papers perspectives, technical papers, field notes, and semiconductor industry insights.
30 articles
Page 2 of 3
Technology Papers
A Study on Alternative Substrate for FCBGA
Technology Papers
Performance Analysis and Impact of Manufacturing Tolerances of multi-layers package substrate for 5G mmWave Antenna in Package/Module (AiP/AiM)
Technology Papers
Design of Dual-Band (28/39GHz) Antenna-in-Package with broad bandwidth for 5G Millimeter-Wave Application
Technology Papers
Dk/Df Extraction and Moisture Effect on mmWave Fan-out Package Design
Technology Papers
Broadband Dual-Polarized Antenna Array using AiP Techniques for 5G mmWave Beamforming Systems
Technology Papers
Board-Level Drop Impact Reliability Analysis of Dual-Side Molding System-in-Package (SiP) Modules
Technology Papers
Investigation of Low-Pressure Sn-Passivated Cu-to-Cu Direct Bonding in 3D-Integration
Technology Papers
Panel Level IC-Package Technology Development
Technology Papers
Finite Element Influence Analysis of Power Module Design Options
Technology Papers
Die Bonding Solution for Flip Chip-Chip Scale Package-DIC (Digital Image Correlation) and Shadow Moiré Application
Technology Papers