Solutions
Stress & Thermal Lab
Modeling & simulation
Numerical simulation of package stress, thermal dissipation and mold-flow, at package, board and system level.
- Thermal-stress analysis (warpage, die stress, delamination)
- System / board-level analysis (TCT, drop, bending)
- Wire-bonding / wire-looping simulation
- Customized heat-sink effects
- Preliminary thermal studies for MCM / SiP
- Hot-spot impact evaluations
- Transient analyses for power-pulse impacts
- Compact thermal models (CTMs) for system-level simulation
- Simulations for packages in sockets (burn-in / HTOL conditions)
- Mold-flow prediction
Modeling & simulation
Mechanical and thermal measurement to verify package and system performance after design and manufacture.
Mechanical
- Die-strength flexural; wafer/panel-level warpage; stud-pull interface strength
- Material dog-bone tensile; board/system-level free-fall; die-pull (UBM/bump integrity)
- IC static-force compression; solder-ball hot-bump-pull (HBP) strength
- JEDEC / customized board-level reliability (TCT, THD, drop, shock, bending, vibration, twist)
Thermal
- θJA (junction-to-ambient), θJB (junction-to-board), ΨJB (junction-to-board parameter)
- θJC (junction-to-case), ΨJT (junction-to-top parameter)
- Wind-tunnel testing (forced convection); material thermal conductivity
- IC hot-spot analysis with thermal image
Modeling & simulation
Pre-design solutions built on a large database of reliability, simulation and co-design projects.
- Warpage & component-stress prediction
- Package / board-level reliability analysis
- Customized co-design / simulation (system analysis and co-design)
- Packaging-material selection & structure design
- Thermal-optimal design for packages
See Other labs
