Plastic BGA (PBGA)
- Impedance
- Package design optimization (DDR, SerDes, Power…)
- RF filter design & characterization
- Package EMI shielding design (conformal, compartment)
Solutions
Electrical Lab
Overview
The ASE Electrical Lab (E-Lab) designs, analyzes and characterizes IC-package electrical behavior through simulation and measurement.
E-Lab works with customers on package design optimization, system-level SI/PI analysis, high-speed and high-frequency verification, and turnkey passive-filter solutions. It also offers accurate measurement for package characterization, electrical failure analysis, and chip- and system-level mmWave antenna-in-package (AiP).
services
Design & simulation service
fcCSP Substrate
- Package R/L/C modeling
- S-parameter modeling
- IBIS / SPICE / S-param model export
BOC (DDR substrate)
Signal integrity
- TDR simulation
- Eye diagram
- Crosstalk / jitter / timing analysis
Power integrity
- DCIR drop
- PDN
- De-cap optimization
- Power noise
services
Measurement service
S-parameter
- Up to 170 GHz double-side probe station
- Up to 260 GHz single-side probe station
- 12-inch wafer & panel-level probe station
Electrical FA
- TDR impedance
- 4-wire DCR (open / short)
Parasitic
- Component level
- On-chip capacitor
- RF inductor
services
Antenna-in-Package (AiP) service
Spherical chamber
Chip/package-level passive test with a probing feed.
- Spherical & direct far field
- Frequency 18–110 GHz
- Antenna gain, 2D pattern
Compact Antenna Test Range (CATR)
System-level active test with a connector feed.
- Quiet zone 30×30 cm²
- Frequency 18–110 GHz
- Antenna gain, EIRP, 3D pattern
- Beamforming test
See Other labs
