How packaging houses compare to foundries, and what impact consolidation will have on different IC manufacturing segments. BY: MARK LAPEDUS
March 18, 2016 – Semiconductor Engineering sat down to discuss the IC-packaging industry, foundries, China and other topics with Tien Wu, chief operating officer at Taiwan’s Advanced Semiconductor Engineering (ASE), the world’s largest outsourced semiconductor assembly and test (OSAT) vendor. What follows are excerpts of that conversation.
Inside the OSAT Business: Q&A with ASE (by Mark LaPedus of Semiengineering)
