ASE Hosts Third-Annual Tech Forum on Semiconductor Packaging and Test

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ASE Hosts Third-Annual Tech Forum on Semiconductor Packaging and Test

Santa Clara, Calif., June 3, 2002 – Advanced Semiconductor Engineering, Inc. (ASE) (NYSE: ASX), one of the world’s largest semiconductor IC packaging and test companies, will host its third annual Tech Forum in June. This year, the one-day symposium will be held in Austin, Texas, June 13; Santa Clara (Silicon Valley), Calif., June 18; and Ottawa, Ontario, Canada, June 20.

The ASE Tech Forum is designed to provide chip makers with the latest trends in semiconductor back-end assembly and test technology, focusing on maximizing chip performance and minimizing time-to-market.

“This year’s ASE Tech Forum comes at a critical time for our partners in the semiconductor industry as we emerge from one of the worst economic downturns, ” said Dr. Tien Wu, president, ASE Americas and Europe. “The ASE Tech Forum will pull together some of the brightest minds in the industry to discuss and present next-generation semiconductor packaging and test solutions.”

The ASE Tech Forum 2002 highlights include: 

To register for the ASE Tech Forum 2002 or to find more information about the event, please visit the event website at http://www.asetechforum.com