Next-Generation Advanced Packaging
Panel-Level Packaging
ASE's industry-first automated 310mm × 310mm panel-level packaging production line expands advanced fan-out packaging with greater usable area, higher throughput, and improved material efficiency for AI and HPC systems.
310mm × 310mm Format
Scaling advanced packaging from wafers to panels
ASE's automated panel-level packaging line enables a seamless transition from wafer-level packaging while preserving design-rule consistency across the FOCoS and FOCoS-Bridge platforms.
Replacing traditional round wafers with rectangular panels provides up to 96,100 mm² of usable area per panel, allowing more dies per unit and improving material efficiency as interposer and package dimensions continue to grow.
Compatible with FOCoS and FOCoS-Bridge
The platform carries ASE's established advanced-packaging design rules into a larger, high-productivity format.
Higher throughput for larger, more complex systems
Large-area processing and fewer tool-change steps increase throughput, reduce cycle time, and lower cost per package. The flexible platform also supports heterogeneous integration and System-in-Package solutions with increasingly complex multi-die architectures.
These advantages are especially important for AI data centers and high-performance computing, where larger package sizes, higher I/O density, and faster time to market are central design requirements.
- More dies per unit and improved material utilization
- Higher throughput with reduced cycle time and package cost
- A scalable foundation for heterogeneous and multi-die integration
- Support for AI, HPC, networking, high-end gaming, and edge AI