Panel-Level Packaging

ASE's industry-first automated 310mm × 310mm panel-level packaging production line expands advanced fan-out packaging with greater usable area, higher throughput, and improved material efficiency for AI and HPC systems.

310mm × 310mm Format

Scaling advanced packaging from wafers to panels

ASE's automated panel-level packaging line enables a seamless transition from wafer-level packaging while preserving design-rule consistency across the FOCoS and FOCoS-Bridge platforms.

Replacing traditional round wafers with rectangular panels provides up to 96,100 mm² of usable area per panel, allowing more dies per unit and improving material efficiency as interposer and package dimensions continue to grow.

310 × 310mmautomated panel format

96,100mm²usable area per panel

2027expected production entry

Compatible with FOCoS and FOCoS-Bridge

The platform carries ASE's established advanced-packaging design rules into a larger, high-productivity format.

FOCoS

2/2µm line and space

Fine-pitch fan-out chip-on-substrate integration for high-I/O chiplet and memory architectures.

FOCoS-Bridge

8/8µm line and space

Localized high-density interconnect using embedded silicon bridge technology.

Higher throughput for larger, more complex systems

Large-area processing and fewer tool-change steps increase throughput, reduce cycle time, and lower cost per package. The flexible platform also supports heterogeneous integration and System-in-Package solutions with increasingly complex multi-die architectures.

These advantages are especially important for AI data centers and high-performance computing, where larger package sizes, higher I/O density, and faster time to market are central design requirements.