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The official archive of ASE company news, technology announcements, awards, partnerships, and global manufacturing updates.

250 articles

Page 19 of 21

ASE Receives Raytheon Supplier Scorecard Award

ASE Receives Raytheon Supplier Scorecard Award

ASE Marks Volume Production Milestone on Wafer Level

ASE Marks Volume Production Milestone on Wafer Level

ASE qualifies wire-bond and flip-chip assemblies for ICs using TSMC’s all-copper, 0.13-micron low-K

ASE qualifies wire-bond and flip-chip assemblies for ICs using TSMC’s all-copper, 0.13-micron low-K

ASE completes internal development of electroplated wafer bumping technology

ASE completes internal development of electroplated wafer bumping technology

Silicon Laboratories and ASE announce milestone shipment of 10 million tested integrated circuits

Silicon Laboratories and ASE announce milestone shipment of 10 million tested integrated circuits

Altera Qualifies ASE’s Lead-Free Packages

Altera Qualifies ASE’s Lead-Free Packages

ASE Announces Collaboration with AMD in Flip Chip Development for Chipset Assembly

ASE Announces Collaboration with AMD in Flip Chip Development for Chipset Assembly

ASE Embarks on Volume Production of Image Sensor Packages

ASE Embarks on Volume Production of Image Sensor Packages

ASE’s Packaging Technology Enables Wireless Communication Chips from Leading European IC Design Hous

ASE’s Packaging Technology Enables Wireless Communication Chips from Leading European IC Design Hous

ASE Receives Sub-contracting Supplier of the Year Award from Tower Semiconductor

ASE Receives Sub-contracting Supplier of the Year Award from Tower Semiconductor

ASE Announces Volume Production Capability in 300mm Wafer Flip Chip Bumping

ASE Announces Volume Production Capability in 300mm Wafer Flip Chip Bumping

ISE Labs and MuAnalysis Form Alliance to Enhance Analytical Test Services for the Canadian Semicondu

ISE Labs and MuAnalysis Form Alliance to Enhance Analytical Test Services for the Canadian Semicondu