We announced Fan-Out Chip-on-Substrate-Bridge (FOCoS-Bridge) with Through Silicon Via (TSV), a significant packaging advancement to help propel technology enablement for AI and its pervasive impact on global life. It’s part of the continued evolution of ASE’s VIPack, our scalable advanced packaging platform that continues to expand in alignment with industry roadmaps and for SiliconPhotonics progression. Here are ASE’s Mark Gerber and Charles Lee who shared their thoughts on the show floor.
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