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ECTC 2025 Part Three

The ASE Diaries
ASE diagram of an advanced chiplet package combining an active interposer, HBM, and an optical engine

Next in our series, The ASE Diaries: ECTC 2025 part three underscores the huge challenge associated with power, yet highlights how ASE and our technology teams are utterly motivated to creatively advance our packaging technologies to deliver performance optimization and energy efficiency.

Between chiplets and fanout, thanks to Lihong Cao, Wiwy Wudjud, and Roger Lo for sharing their perspectives—and passion—on the floor at ECTC 2025.

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